The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Feb. 14, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Daisuke Ueyama, Nara, JP;

Chiaki Doumoto, Goleta, CA (US);

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01S 5/022 (2021.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H01S 5/022 (2013.01); H05K 1/0306 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A multipiece element storage package of the present disclosure includes: a mother substrate which includes first element storage package regions, second element storage package regions, a dummy region, a first surface, and a second surface; a first stem electrode disposed in a part of the dummy region which part is in the first surface; and a second stem electrode disposed on the second surface. The first element storage package regions and the second element storage package regions each include a frame body disposed on the first surface, a first wiring conductor disposed on the first surface, and including one end located inside the frame body and the other end connected to the first stem electrode, and a second wiring conductor including one end which is located on the first surface and inside the frame body and the other end which is connected to the second stem electrode.


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