The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Apr. 22, 2020
Applicant:

The Regents of the University of California, Oakland, CA (US);

Inventors:

Keith Corzine, Santa Cruz, CA (US);

Vahid Dargahi, Santa Cruz, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/483 (2007.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H02M 7/483 (2013.01); H02M 7/53871 (2013.01); H02M 7/4835 (2021.05);
Abstract

A Modular Multilevel Converter (MMC) circuit for converting DC power to AC and vice versa. At each respective connection to the AC power-source/load, the MMC circuit uses one Pulse Width Modulation Insulated Gate Bipolar Transistor (PWM IGBT) to control the switching between upper and lower arms of sub-modules. The circuit eliminates the inter-phase inductors often used in MMCs, and replaces the inductors by two complementary-gated PWM IGBTs, thereby eliminating circulating current. Moreover, the multilevel converter topology disclosed herein requires less number of components including PWM IGBTs and capacitors. In fact, at least two submodules per-phase are eliminated: one submodule in the upper arm and one submodule in the lower arm. In other words, the MMC topology not only mitigates the circulating current but also eliminates at least one submodule in the upper arm and at least one submodule in the lower arm per-phase.


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