The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Dec. 14, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Qianwen Chen, Yorktown Heights, NY (US);

Bing Dang, Chappaqua, NY (US);

John Knickerbocker, Monroe, NY (US);

Bo Wen, New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/04 (2006.01); H01M 50/116 (2021.01); H01M 10/0525 (2010.01); H01M 10/0565 (2010.01); H01M 10/0562 (2010.01); H01M 6/40 (2006.01); H01M 6/18 (2006.01); H01M 50/10 (2021.01); H01M 50/20 (2021.01); H01M 50/183 (2021.01);
U.S. Cl.
CPC ...
H01M 50/116 (2021.01); H01M 6/18 (2013.01); H01M 6/40 (2013.01); H01M 10/049 (2013.01); H01M 10/0436 (2013.01); H01M 10/0525 (2013.01); H01M 10/0562 (2013.01); H01M 10/0565 (2013.01); H01M 50/10 (2021.01); H01M 50/183 (2021.01); H01M 50/20 (2021.01);
Abstract

Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.


Find Patent Forward Citations

Loading…