The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

May. 31, 2019
Applicant:

Magnachip Semiconductor, Ltd., Cheongju-si, KR;

Inventors:

Guk Hwan Kim, Cheongju-si, KR;

Jin Yeong Son, Cheongju-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 29/08 (2006.01); H01L 23/544 (2006.01); H01L 27/088 (2006.01); H01L 29/06 (2006.01); H01L 21/761 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66681 (2013.01); H01L 21/76224 (2013.01); H01L 23/544 (2013.01); H01L 27/088 (2013.01); H01L 29/0653 (2013.01); H01L 29/0856 (2013.01); H01L 29/0873 (2013.01); H01L 29/42376 (2013.01); H01L 29/7816 (2013.01); H01L 21/761 (2013.01); H01L 2223/54426 (2013.01);
Abstract

A semiconductor device manufacturing method includes forming a first trench insulating film of a first depth in a substrate, forming at least one second trench insulating film that is spaced apart from the first trench insulating film and has a second depth that is greater than the first depth, forming a body region of a first conductivity type and a drift region of a second conductivity type in the substrate, forming a gate electrode overlapping the first trench insulating film, forming a source region in the body region and a drain region in the drift region, forming a silicide film on the drain region, and forming a non-silicide film between the first trench insulating film and the drain region, wherein the first trench insulating film overlaps the drift region and the gate electrode.


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