The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Dec. 18, 2018
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Ryuichi Oikawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/17181 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Cross talk among wirings formed in an interposer is reduced while increase in a parasitic capacitance among the wirings formed in the interposer is suppressed. A semiconductor device has an interposer including a first wiring layer, a second wiring layer formed above the first wiring layer, and a third wiring layer formed above the second wiring layer. In a plan view, a first signal wiring formed in the first wiring layer and a reference wiring formed in the second wiring layer are distant from each other. Similarly, in a plan view, the reference wiring formed in the second wiring layer and a third signal wiring formed in a third wiring layer are distant from each other.


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