The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Jan. 06, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jason J. Bjorgaard, Rochester, MN (US);

Layne A. Berge, Rochester, MN (US);

John R. Dangler, Rochester, MN (US);

Matthew Doyle, Chatfield, MN (US);

Thomas W. Liang, Rochester, MN (US);

Kyle Schoneck, Rochester, MN (US);

Matthew A. Walther, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/1316 (2013.01); H01L 2224/13076 (2013.01); H01L 2224/13149 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/0133 (2013.01);
Abstract

A solder ball assembly can include a first spring element having a first shape and formed from a first elastic electrically conductive material. The solder ball assembly can also include a second spring element having a second shape and formed from a second elastic electrically conductive material. The second spring element is mechanically attached to the first spring element to form a spring assembly. The solder ball can be configured to enclose the spring assembly.


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