The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Jan. 30, 2020
Applicant:

The Government of the United State of America, As Represented BY the Secretary of the Navy, Arlington, VA (US);

Inventors:

Nadeemullah A. Mahadik, Springfield, VA (US);

Robert E. Stahlbush, Silver Spring, MD (US);

Marko J. Tadjer, Springfield, VA (US);

Karl D. Hobart, Alexandria, VA (US);

Francis J. Kub, Arnold, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/02 (2006.01); B28D 5/00 (2006.01); H01L 21/66 (2006.01); H01L 21/268 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B28D 5/0005 (2013.01); H01L 21/02035 (2013.01); H01L 21/268 (2013.01); H01L 22/12 (2013.01);
Abstract

A method of cleaving includes providing a substrate. Optionally, the substrate includes β-gallium oxide, hexagonal zinc sulfide, or magnesium selenide. The substrate includes at least one natural cleave plane and a crystallinity. The substrate is cleaved along a first natural cleave plane of the at least one natural cleave plane. The cleaving the substrate along the first natural cleave plane includes the following. A micro-crack is generated in the substrate while maintaining the crystallinity adjacent to the micro-crack by generating a plurality of phonons in the substrate, the micro-crack comprising a micro-crack direction along the first natural cleave plane. The micro-crack is propagated along the first natural cleave plane while maintaining the crystallinity adjacent to the micro-crack. Optionally, generating a micro-crack in the substrate by generating a plurality of phonons in the substrate includes generating the plurality of phonons by electron-hole recombination. Optionally, the electron-hole recombination includes non-radiative electron-hole recombination.


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