Method of fabricating semiconductor device and encapsulant

Abstract

A method of fabricating a semiconductor device with improved quality and an encapsulant are provided. The method may include coating a chip wafer including a plurality of semiconductor chips with an encapsulant, performing a pre-curing process to bring the encapsulant into a B-stage, dicing the chip wafer to divide the chip wafer into a plurality of semiconductor chips, forming a chip stack by stacking the semiconductor chip on the base wafer in such a way that a coupling electrode on the base wafer and a bump electrode of each of the semiconductor chips face each other with a conductive adhesive element interposed therebetween, performing a reflow process on the chip stack under pressurized gas to bond the coupling electrode and the bump electrode to each other with the conductive adhesive element interposed therebetween, and performing a post-curing process on the chip stack under pressurized gas to bring the encapsulant into a C-stage.