The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Jan. 28, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Seon Uk Hwang, Suwon-si, KR;

Young June Lee, Suwon-si, KR;

Hyun Ho Shin, Suwon-si, KR;

Hong Kyu Shin, Suwon-si, KR;

Hyun Sub Oh, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/008 (2006.01); H01G 9/048 (2006.01); H01G 9/00 (2006.01); H01G 9/04 (2006.01); H01G 9/15 (2006.01);
U.S. Cl.
CPC ...
H01G 9/048 (2013.01); H01G 9/008 (2013.01); H01G 9/0029 (2013.01); H01G 9/15 (2013.01); H01G 2009/05 (2013.01);
Abstract

A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.


Find Patent Forward Citations

Loading…