The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Aug. 02, 2019
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Shogo Kanbe, Nagaokakyo, JP;

Masahiro Andatsu, Nagaokakyo, JP;

Kosuke Nakano, Nagaokakyo, JP;

Hideki Otsuka, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/232 (2013.01); H01G 2/06 (2013.01); H01G 4/30 (2013.01); H01G 4/1227 (2013.01); H01G 4/1236 (2013.01);
Abstract

A multilayer ceramic electronic component includes a laminate including external electrodes connected to a pair of metal terminals through a bonding material. Each of the pair of metal terminals includes a terminal body, an extension portion, and a mounting portion. The terminal body includes side-surface ribs, opposed to the side surfaces of the electronic component body. The bonding material is provided between the side-surface ribs and the external electrode opposed to the side-surface rib and is not provided between the terminal body and the end surface center portion of the external electrode.


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