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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11170935 B1

PDFFull Text
Date of Patent:
Nov. 09, 2021

Filed:

Jul. 27, 2017

Manufacturing method for electronic component including electrode formed by removal of insulating layer by laser light

Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Eiji Iso, Nagaokakyo, JP;

Shinichiro Izumi, Nagaokakyo, JP;

Yoshifumi Maki, Nagaokakyo, JP;

Hirotsugu Tomioka, Nagaokakyo, JP;

Tsuyoshi Kawada, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Peter Dungba Vo

Assistant Examiner:

Jeffrey T Carley

Int. Cl.
CPC ...
H01F 41/12 (2006.01); H01G 4/224 (2006.01); H01G 2/20 (2006.01); H01G 4/252 (2006.01); H01F 41/04 (2006.01); H01G 4/232 (2006.01); H01F 41/00 (2006.01); H01F 17/00 (2006.01); H01F 27/02 (2006.01); H01F 41/10 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 41/12 (2013.01); H01F 17/0013 (2013.01); H01F 27/022 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 27/32 (2013.01); H01F 41/005 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 41/10 (2013.01); H01F 41/125 (2013.01); H01F 41/127 (2013.01); H01G 2/20 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01); H01G 4/252 (2013.01); H01F 17/04 (2013.01); H01F 2027/2809 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01);
Abstract

A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.

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