The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Feb. 02, 2018
Applicant:

Alpha and Omega Semiconductor (Cayman) Ltd., Sunnyvale, CA (US);

Inventors:

Jung-Pei Cheng, Zhubei, TW;

Hsiang-Chung Chang, Zhubei, TW;

Yu-Ming Chen, Hsinchu, TW;

Chieh-Wen Cheng, Hsinchu, TW;

Tsung-Han Ou, Hsinchu, TW;

Lih-Ming Doong, Zhunan Township, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 19/04 (2006.01); H01L 25/065 (2006.01); H01F 27/29 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01F 19/04 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01L 23/58 (2013.01); H01L 25/0655 (2013.01); H01F 2027/2809 (2013.01);
Abstract

An isolation coupling structure for transmitting a feedback signal between a secondary side and a primary side of a voltage conversion device includes a first dielectric layer including a first face and a second face opposite to the first face, a first coupling coil disposed on the first face enclosing to form an inner region; a second coupling coil configured to couple with the first coupling coil. The second coupling coil includes a first coil portion and a second coil portion, where the first coil portion is disposed on the second face, the second coil portion is disposed on the first face and located inside the inner region. The second coil portion is isolated from the first coupling coil, and the first coil portion and the second coil portion are electrically connected. The technical effect is that it can realize the electrical isolation and the coupling with low cost and small package size.


Find Patent Forward Citations

Loading…