The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Apr. 22, 2020
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Te-Ying Tsai, Hsin-Chu, TW;

Kun-Chieh Chan, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 21/16 (2006.01); G03B 21/14 (2006.01); H05K 7/20 (2006.01); H04N 9/31 (2006.01); G02B 27/09 (2006.01);
U.S. Cl.
CPC ...
G03B 21/16 (2013.01); G02B 27/0955 (2013.01); G03B 21/142 (2013.01); H04N 9/3144 (2013.01); H04N 9/3197 (2013.01); H05K 7/20972 (2013.01);
Abstract

An optical engine module includes a housing, an assembling element, a light valve and a first heat exchange assembly. The assembling element has an opening corresponding to an assembly hole of the housing and is assembled on the housing in a non-direct contact mode. The light valve includes a base and an imaging element. The base bears against the assembling element, and an imaging surface of the imaging element faces the opening. The housing, the assembling element and the light valve define a chamber. The first heat exchange assembly is disposed on the assembling element and includes at least one first heat conduction component and a first heat dissipation fin set. The first heat dissipation fin set is located outside the housing. The first heat conduction component extends from the assembling element to the outside of the housing and is connected with the first heat dissipation fin set.


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