The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Jun. 06, 2019
Zhejiang Super Lighting Electric Appliance Co., Ltd, Zhejiang, CN;
Tao Jiang, Zhejiang, CN;
Wei-Hong Xu, Zhejiang, CN;
Yukihiro Saito, Zhejiang, CN;
Hayato Unagiike, Zhejiang, CN;
Ai-Ming Xiong, Zhejiang, CN;
Jun-Feng Xu, Zhejiang, CN;
Yi-Ching Chen, Taichung, TW;
ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD, Jinyun, CN;
Abstract
A light bulb, consisting of: a lamp housing doped with a golden yellow material or its surface coated with a yellow film; a bulb base connected to the lamp housing; a stem connected to the bulb base and located in the lamp housing, the stem comprises a stand extending to the center of the lamp housing; and a single LED filament, disposed in the lamp housing, the LED filament comprising: a plurality of LED sections, each of the LED sections includes at least two LED chips that are electrically connected to each other by a wire; a plurality of conductive sections, each of the conductive sections is located between the two adjacent LED sections and configured to electrically connect the two adjacent LED sections; a plurality of supporting arms, each of the supporting arms comprises a first end and a second end opposite to the first end of the supporting arms, the first end of each of the supporting arms is connected with the stand while the second end of each of the supporting arms is connected with the LED filament; the base layer of the light conversion layer is formed from organosilicon-modified polyimide resin composition comprising an organosilicon-modified polyimide and a thermal curing agent.