The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Feb. 26, 2020
Applicant:

E.construct.usa, Llc, Omaha, NE (US);

Inventors:

Maher K. Tadros, Omaha, NE (US);

Micheal Asaad, Omaha, NE (US);

Bradley Schipper, Valley, NE (US);

Assignee:

e.Construct.USA, LLC, Omaha, NE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E04B 5/04 (2006.01); E04B 5/48 (2006.01);
U.S. Cl.
CPC ...
E04B 5/043 (2013.01); E04B 5/48 (2013.01);
Abstract

An ultra high performance concrete (UHPC) voided slab panel may include a top slab including a top skin and a bottom slab including a bottom skin. The top slab and the bottom slab may be joined at a joint filled with a joint material and positioned a select height within the UHPC voided slab panel. The top slab and the bottom slab may be joined via a connector assembly. The panel may include least two ribs defining at least one void accessible via at least one opening through an exterior surface of the UHPC voided slab panel. The UHPC voided slab panel may be fabricated from UHPC and a plurality of embedded prestressing strands, and may be configured to meet select strength requirements that are greater than select strength requirements for conventional precast concrete without reinforcing bars being embedded within the UHPC voided slab panel.


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