The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11168232 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 09, 2021

Filed:

Feb. 14, 2019
Applicant:

Ardex Group Gmbh, Witten, DE;

Inventor:

Bryant Buschman, St. Augustine, FL (US);

Assignee:

Ardex Group GmbH, Witten, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01); C08K 3/013 (2018.01); C09J 7/10 (2018.01); B29C 70/58 (2006.01); B32B 27/36 (2006.01); C08K 3/40 (2006.01); C09J 167/02 (2006.01); E04F 15/08 (2006.01); B29K 67/00 (2006.01); B29K 505/12 (2006.01); B29K 509/08 (2006.01); C08K 3/08 (2006.01); E04F 15/02 (2006.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); B29C 70/58 (2013.01); B32B 27/36 (2013.01); C08K 3/013 (2018.01); C08K 3/40 (2013.01); C09J 7/10 (2018.01); C09J 167/02 (2013.01); E04F 15/08 (2013.01); B29K 2067/003 (2013.01); B29K 2505/12 (2013.01); B29K 2509/08 (2013.01); B32B 2405/00 (2013.01); B32B 2471/04 (2013.01); C08K 2003/0856 (2013.01); C08K 2201/001 (2013.01); C09J 2400/14 (2013.01); C09J 2400/16 (2013.01); C09J 2467/00 (2013.01); E04F 15/02155 (2013.01); E04F 2290/04 (2013.01);
Abstract

Exemplary methods for installing tile using a reactivatable tile bonding mat is disclosed. The reactivatable tile bonding mat is placed upon a substantially flat surface. Stone, porcelain or ceramic tile is placed and arranged on the reactivatable tile bonding mat in an aesthetically pleasing fashion, in some cases aided by the use of spacers in the joints between the sides of the tiles. Induction, or some other method of heat, is applied to the upper surfaces of the tiles, to quickly transfer through the tile, causing a polymer hot-melt material embedded in the reactivatable tile bonding mat to melt and adhere to a lower surface of the tiles, forming a strong bond. Upon the tiles fully bonding to the reactivatable tile bonding mat, spacers may be removed and a suitable grout may be applied in the joints between the sides of the tiles.


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