The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Apr. 19, 2019
Applicant:

Elite Electronic Material (Zhongshan) Co., Ltd, Zhongshan, CN;

Inventors:

Zhilong Hu, Zhongshan, CN;

Teng Xu, Zhongshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/5313 (2006.01); C08F 220/14 (2006.01); C08J 5/24 (2006.01); C08J 5/18 (2006.01); H05K 1/03 (2006.01); C08F 212/36 (2006.01);
U.S. Cl.
CPC ...
C08K 5/5313 (2013.01); C08F 212/36 (2013.01); C08F 220/14 (2013.01); C08J 5/18 (2013.01); C08J 5/24 (2013.01); H05K 1/0373 (2013.01); C08J 2325/02 (2013.01); C08J 2333/12 (2013.01); C08J 2361/28 (2013.01); C08J 2371/12 (2013.01); C08J 2425/02 (2013.01); C08J 2433/12 (2013.01); C08J 2461/28 (2013.01); C08J 2471/12 (2013.01); H05K 2201/012 (2013.01);
Abstract

The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.


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