The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Apr. 26, 2018
Applicants:
Autonetworks Technologies, Ltd., Mie, JP;
Sumitomo Wiring Systems, Ltd., Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventors:
Housei Mizuno, Mie, JP;
Hiroki Hirai, Mie, JP;
Haruka Nakano, Mie, JP;
Motohiro Yokoi, Mie, JP;
Shigeki Ikeda, Mie, JP;
Daisuke Fukai, Mie, JP;
Tetsuya Nishimura, Mie, JP;
Assignees:
AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;
SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/21 (2018.01); C09J 7/38 (2018.01); H01B 7/40 (2006.01); H02G 3/30 (2006.01); B60R 16/02 (2006.01);
U.S. Cl.
CPC ...
B60R 16/0215 (2013.01); C09J 7/21 (2018.01); C09J 7/38 (2018.01); H01B 7/40 (2013.01); H02G 3/30 (2013.01); C09J 2203/00 (2013.01); C09J 2301/124 (2020.08); C09J 2301/18 (2020.08);
Abstract
A wiring module includes a wiring body including at least one conductive wiring, an pressure-sensitive adhesive part provided on the wiring body, and a peeling part, provided on the wiring body, to which the pressure-sensitive adhesive part sticking in a manner easily peeled from the peeling part.