The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
May. 28, 2019
Canon Kabushiki Kaisha, Tokyo, JP;
Masashi Ishikawa, Chofu, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
The method of manufacturing a liquid ejection head according to the invention includes a bonding step, that is, a step of placing a plurality of element substrates on an adhesive layer formed on a bonding surface and heating the adhesive layer to bond the element substrates to a base material. The bonding step is started from one or two of a plurality of bonding regions located at the center portion of the base material in an arrangement direction of the element substrates and then performed toward the bonding regions located at both end portions of the base material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile