The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Jan. 11, 2017
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Takayuki Shimizu, Tokyo, JP;
Toshio Abe, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A composite-material molding apparatus for molding a composite material, wherein the molding apparatus is provided with: a main body; a composite-material layer in which a molding face for molding a composite material is formed, the composite-material layer coating the surface of the main body; a filamentous fiber-optic temperature sensor embedded in the composite-material layer; a heating unit provided inside the main body; and a control device for controlling the heating unit on the basis of the temperature measured by the fiber-optic temperature sensor; the fiber-optic temperature sensor being disposed in planar fashion in a plane parallel to the molding face.