The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Aug. 09, 2019
Applicant:
The Research Foundation for the State University of New York, Binghamton, NY (US);
Inventors:
Scott N. Schiffres, Vestal, NY (US);
Arad Azizi, Karaj, IR;
Assignee:
The Research Foundation for the State University of New York, Binghamton, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); H01L 21/283 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); B33Y 80/00 (2015.01); F28F 21/02 (2006.01); B32B 7/12 (2006.01); F28D 15/00 (2006.01); B32B 15/01 (2006.01); F28F 21/00 (2006.01); F28F 21/04 (2006.01); F28F 21/08 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B32B 7/12 (2013.01); B32B 15/01 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); F28D 15/00 (2013.01); F28F 21/006 (2013.01); F28F 21/02 (2013.01); F28F 21/04 (2013.01); F28F 21/081 (2013.01); H01L 21/283 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); B32B 2457/00 (2013.01); F28F 2210/00 (2013.01);
Abstract
A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.