The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

May. 12, 2014
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka, JP;

Inventors:

Maki Ito, Tokyo, JP;

Toshiaki Ishii, Tokyo, JP;

Masaru Kamoshida, Ibaraki, JP;

Hideto Yoshinari, Ibaraki, JP;

Masato Saito, Ibaraki, JP;

Akitoyo Konno, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H05K 7/20854 (2013.01); H05K 1/0206 (2013.01); H05K 1/0209 (2013.01); H05K 1/18 (2013.01); H05K 7/20409 (2013.01); H01R 12/724 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10189 (2013.01);
Abstract

Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. The box-type vehicle-mounted control device includes a circuit board, a base, and a cover. In addition, a first heat radiating coating layeris formed on at least one surface of the circuit board, and a second heat radiating coating layeris formed on an inner surface of one or both of the baseand the coverfacing the first heat radiating coating layer


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