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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11166384 B1

PDFFull Text
Expired
Date of Patent:
Nov. 02, 2021

Filed:

Mar. 20, 2019

Fabrication process for flip chip bump bonds using nano-leds and conductive resin

Applicant:

Konica Minolta Laboratory U.s.a., Inc., San Mateo, CA (US);

Inventors:

Karsten Bruening, Portola Valley, CA (US);

Jun Amano, Hillsborough, CA (US);

Assignee:

KONICA MINOLTA LABORATORY U.S.A., INC., San Mateo, CA (US);

Attorney:

Chen Yoshimura LLP

Primary Examiner:

Peter Dungba Vo

Assistant Examiner:

Jeffrey T Carley

Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 3/30 (2006.01); H01L 33/32 (2010.01); H01L 33/24 (2010.01); H01L 27/15 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 3/303 (2013.01); H01L 27/156 (2013.01); H01L 33/24 (2013.01); H01L 33/32 (2013.01); H05K 1/181 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0221 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0783 (2013.01);
Abstract

A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 μm using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 μm, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.

Find Patent Forward Citations

Bruening, Karsten. (2021). Fabrication process for flip chip bump bonds using nano-leds and conductive resin (U.S. Patent No. 11166384). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11166384

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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