The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Nov. 05, 2020
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Yoshiaki Ichikawa, Makinohara, JP;

Tatsuya Oga, Makinohara, JP;

Mariko Nakagawa, Makinohara, JP;

Tomoji Yasuda, Makinohara, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/36 (2006.01); H01L 23/532 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/361 (2013.01); H01L 23/53295 (2013.01); H05K 1/189 (2013.01); H05K 3/303 (2013.01); H05K 3/321 (2013.01); H05K 2201/10007 (2013.01);
Abstract

A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.


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