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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11166380 B1

PDFFull Text
Date of Patent:
Nov. 02, 2021

Filed:

Oct. 16, 2020

Method of manufacture of a structure and structure

Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Tomi Simula, Oulunsalo, FI;

Mika Paani, Oulunsalo, FI;

Miikka Kärnä, Oulunsalo, FI;

Outi Rusanen, Oulunsalo, FI;

Johanna Juvani, Oulunsalo, FI;

Tapio Rautio, Oulunsalo, FI;

Marko Suo-Anttila, Oulunsalo, FI;

Mikko Heikkinen, Oulunsalo, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:

Robert P. Michal, Esq.

Carter, DeLuca & Farrell LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/08 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 3/44 (2006.01); H01L 21/00 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/77 (2017.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/16 (2006.01); H01L 23/18 (2006.01); H01L 23/24 (2006.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/538 (2006.01); H05K 5/03 (2006.01); B29C 45/14 (2006.01); H05K 5/06 (2006.01); B29K 101/12 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); B29C 45/14819 (2013.01); H05K 1/181 (2013.01); H05K 5/03 (2013.01); H05K 5/065 (2013.01); B29K 2101/12 (2013.01); B29L 2031/3406 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

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