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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11166351 B1

PDFFull Text
Date of Patent:
Nov. 02, 2021

Filed:

Sep. 21, 2018

Solder reflow apparatus and method of manufacturing an electronic device

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sin-Yeob Lee, Asan-si, KR;

Dong-Woo Shin, Asan-si, KR;

Hyun-Seok Choi, Ansan-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Ibrahime A Abraham

Assistant Examiner:

Gyounghyun Bae

Int. Cl.
CPC ...
H05B 6/64 (2006.01); H01L 21/263 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H05B 6/80 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05B 6/6447 (2013.01); H01L 21/263 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H05B 6/80 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/755 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/8122 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81048 (2013.01); H01L 2224/81096 (2013.01); H01L 2224/81097 (2013.01); H01L 2224/81098 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81948 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01);
Abstract

In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.

Find Patent Forward Citations

Lee, Sin-Yeob. (2021). Solder reflow apparatus and method of manufacturing an electronic device (U.S. Patent No. 11166351). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11166351

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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