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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11165010 B1

PDFFull Text
Date of Patent:
Nov. 02, 2021

Filed:

Feb. 11, 2019

Cold-welded flip chip interconnect structure

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Eric Peter Lewandowski, White Plains, NY (US);

Jae-Woong Nah, Closter, NJ (US);

Nicholas Torleiv Bronn, Long Island City, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Garg Law Firm, PLLC

Rakesh Garg

Douglas Pearson

Primary Examiner:

Amar Movva

Int. Cl.
CPC ...
H01L 39/04 (2006.01); H01L 23/00 (2006.01); H01L 39/02 (2006.01); H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
H01L 39/045 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/742 (2013.01); H01L 39/025 (2013.01); H01L 39/2493 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81895 (2013.01);
Abstract

In an embodiment, a quantum device includes a first set of protrusions formed on a substrate and a second set of protrusions formed on a qubit chip. In the embodiment, the quantum device includes a set of bumps formed on an interposer, the set of bumps formed of a material having above a threshold ductility at a room temperature range, wherein a first subset of the set of bumps is configured to cold weld to the first set of protrusions and a second subset of the set of bumps is configured to cold weld to the second set of protrusions.

Find Patent Forward Citations

Lewandowski, Eric. (2021). Cold-welded flip chip interconnect structure (U.S. Patent No. 11165010). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11165010

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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