The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Sep. 25, 2019
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Toru Hashimoto, Tokushima, JP;

Yoichi Bando, Anan, JP;

Tadaaki Ikeda, Anan, JP;

Gensui Tamura, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/40 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/405 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.


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