The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Oct. 16, 2017
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Adrien Gasse, Seyssins, FR;

David Henry, Gieres, FR;

Bertrand Chambion, Pontcharra, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/167 (2013.01); H01L 31/02005 (2013.01); H01L 31/186 (2013.01); H01L 33/0095 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The invention relates to a method for producing a first microelectronic chip including a layer of interest having a connection face, intended to be hybridized with a second microelectronic chip. The method including depositing a layer of adhesive on a face of the layer of interest opposite to the first connection face and fastening a handle layer to the layer of adhesive. The method also includes, prior to the steps of depositing the adhesive and fastening the handle layer, defining, on the one hand, a maximum thickness eand a minimum value Eand a maximum value Eof the Young's modulus for the layer of adhesive, and, on the other hand, the minimum thickness efor the handle layer.


Find Patent Forward Citations

Loading…