The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Aug. 30, 2017
Applicants:

Soko Kagaku Co., Ltd., Ishikawa, JP;

Agc Inc., Tokyo, JP;

Inventors:

Akira Hirano, Aichi, JP;

Yosuke Nagasawa, Nara, JP;

Masamichi Ippommatsu, Hyogo, JP;

Ko Aosaki, Tokyo, JP;

Yuki Suehara, Tokyo, JP;

Yoshihiko Sakane, Tokyo, JP;

Assignees:

SOKO KAGAU CO., LTD., Ishikawa, JP;

AGC INC., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light-emitting devicecomprises a base, a nitride semiconductor light-emitting elementflip-chip mounted on the base, and an amorphous fluororesin sealing the nitride semiconductor light-emitting element. The light-emitting devicecomprises a deformation-prevention layerfor preventing a shape change of an amorphous fluororesin by heat treatment after shipment of the light-emitting device, and the deformation-prevention layeris formed of a layer in which a thermosetting resin or an ultraviolet curing resin is cured, and the cured layer directly covers the surface of the amorphous fluororesin.


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