The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Oct. 08, 2019
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Céline Claire Oyer, Cork, IE;

Allan Pourchet, Cork, IE;

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 27/153 (2013.01); H01L 21/6838 (2013.01); H01L 33/62 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of manufacturing light emitting diode (LED) devices is provided. In one example, the method comprises: forming a plurality of LED dies on a starter substrate, each of the plurality of LED dies including a device-side bump; moving, using a pick up tool (PUT), the starter substrate and the plurality of LED dies towards a backplane, the backplane including a plurality of backplane-side bumps; establishing the conductive bonds between the device-side bumps of the plurality of LED dies and the backplane-side bumps of the backplane at the plurality of contact locations; and operating the PUT to release the starter substrate to enable transferring of the plurality of LED dies to the backplane.


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