The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Oct. 08, 2018
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventor:

Chun-Sheng Fan, Hsinchu, TW;

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 24/73 (2013.01); H01L 27/1463 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14687 (2013.01); H01L 2224/02371 (2013.01);
Abstract

An image sensor chip-scale package includes a pixel array, a cover glass covering the pixel array, a dam, and an adhesive layer. The pixel array is embedded in a substrate top-surface of a semiconductor substrate. The semiconductor substrate includes a plurality of conductive pads in a peripheral region of the semiconductor substrate surrounding the pixel array. The dam at least partially surrounds the pixel array and is located (i) between the cover glass and the semiconductor substrate, and (ii) on a region of the substrate top-surface between the pixel array and the plurality of conductive pads. The adhesive layer is (i) located between the cover glass and the semiconductor substrate, (ii) at least partially surrounding the dam, and (iii) configured to adhere the cover glass to the semiconductor substrate.


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