The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Jan. 07, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Akira Kosugi, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
In a semiconductor device, lead frame includes a die pad. The die pad includes a mounting surface and a back surface. The mounting surface includes first and second mounting regions. The back surface includes first and second back regions. The first and second semiconductor elements are mounted on the first and second mounting regions, respectively. The first and second back regions are located on opposite sides from the first and second mounting regions, respectively. The mold resin has the first semiconductor element, the second semiconductor element, and the die pad encapsulated therein and is in direct contact with the second back region. The insulation sheet is disposed on the first back region to be exposed outside the mold resin, the insulation sheet having a thermal conductivity higher than a thermal conductivity of the mold resin.