The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Jul. 23, 2019
International Business Machines Corporation, Armonk, NY (US);
Charles L. Arvin, Poughkeepsie, NY (US);
Kevin Drummond, Wappingers Falls, NY (US);
Luca Del Carro, Adliswil, CH;
Thomas Brunschwiler, Thalwil, CH;
Stephanie Allard, St-Hyacinthe, CA;
Kenneth C. Marston, Poughquag, NY (US);
Marcus E. Interrante, Ulster, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.