The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Jul. 09, 2020
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventors:
Satoshi Enomoto, Utsunomiya, JP;
Masashi Nakamura, Utsunomiya, JP;
Shinichi Tadokoro, Utsunomiya, JP;
Tomokazu Kato, Utsunomiya, JP;
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 13/012 (2006.01); H01R 4/22 (2006.01); H02G 1/06 (2006.01); H02G 3/04 (2006.01); B29C 35/08 (2006.01); B60R 16/02 (2006.01);
U.S. Cl.
CPC ...
H01B 13/012 (2013.01); B29C 35/0805 (2013.01); B60R 16/0215 (2013.01); H01R 4/22 (2013.01); H02G 1/06 (2013.01); H02G 3/04 (2013.01); B29C 2035/0827 (2013.01);
Abstract
A wire harness includes: a harness main body. The harness main body includes a plurality of electric wires and a binding portion. The biding portion is configured to bind the plurality of electric wires. The binding portion is formed by a cured photocurable resin.
Enomoto, Satoshi. (2021). Wire harness, wire harness manufacturing method and wire harness manufacturing device (U.S. Patent No. 11164685). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11164685
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile