The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Jun. 26, 2017
Mitsubishi Electric Corporation, Tokyo, JP;
Yasuhiro Suzuki, Tokyo, JP;
Hirokazu Minamisako, Tokyo, JP;
Kazutaka Suzuki, Tokyo, JP;
Takafumi Mito, Tokyo, JP;
Taro Hattori, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A heat pump apparatus includes a refrigerant circuit and a heat medium circuit. The refrigerant circuit performs a first operation using a load-side heat exchanger as a condenser, and a second operation using the load-side heat exchanger as an evaporator. A suction pipe provided between a refrigerant flow switching valve and a compressor has a container. To the heat medium circuit, an overpressure protection relief valve and a refrigerant leakage detector are connected. When leakage of refrigerant into the heat medium circuit is detected, the refrigerant flow switching valve is switched to a second state, an expansion device is set to a closed state, and the compressor is operated. When a requirement for ending the operation of the compressor is satisfied after the leakage is detected, the compressor is stopped, and the refrigerant flow switching valve is switched to a first state.