The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Jul. 14, 2015
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Kentaro Nomizu, Yamagata, JP;

Mitsuru Ohta, Fukushima, JP;

Masanobu Sogame, Tokyo, JP;

Yoshinori Mabuchi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/04 (2006.01); C08J 5/24 (2006.01); C08K 5/3415 (2006.01); C08K 9/02 (2006.01); B32B 15/08 (2006.01); C08K 3/34 (2006.01); B32B 27/20 (2006.01); C08L 101/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 79/04 (2013.01); B32B 15/08 (2013.01); B32B 27/20 (2013.01); C08J 5/24 (2013.01); C08K 3/34 (2013.01); C08K 5/3415 (2013.01); C08K 9/02 (2013.01); C08L 101/00 (2013.01); H05K 1/0373 (2013.01); C08J 2379/04 (2013.01); C08J 2463/04 (2013.01); C08J 2479/08 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/0266 (2013.01); H05K 2201/06 (2013.01);
Abstract

A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.


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