The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Jun. 20, 2019
Applicant:
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Inventors:
Hisaya Ushiyama, Tokyo, JP;
Nao Deguchi, Tokyo, JP;
Kenichi Watanabe, Tokyo, JP;
Juichi Fujimoto, Tokyo, JP;
Assignee:
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08L 33/24 (2006.01); C08G 59/50 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/245 (2013.01); C08G 59/4021 (2013.01); C08G 59/5033 (2013.01); C08G 59/5046 (2013.01); C08J 5/18 (2013.01); C08J 5/24 (2013.01); C08L 33/24 (2013.01);
Abstract
A curable resin composition including components (A), (B), (C) and (D) below: component (A): a bisphenol epoxy resin with a softening point of 80° C. or more, component (B): a bisphenol epoxy resin which is liquid at 25° C., component (C): a bi- or more-functional (meth)acrylate compound, and component (D): a curing agent.