The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Mar. 25, 2020
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventors:
Shintaro Usui, Tokyo, JP;
Minako Ikeshita, Tokyo, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 29/04 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B65D 65/40 (2006.01);
U.S. Cl.
CPC ...
C08L 29/04 (2013.01); B32B 27/306 (2013.01); B32B 27/34 (2013.01); B65D 65/40 (2013.01); B32B 2270/00 (2013.01); B32B 2553/00 (2013.01);
Abstract
A resin composition contains: (A) an ethylene-vinyl alcohol copolymer; (B) a polyamide resin; and (C) a sorbic acid ester; wherein the sorbic acid ester (C) is present in an amount of 0.00001 to 10 ppm based on the weight of the resin composition. The resin composition is less susceptible to coloration and melt viscosity increase.
Usui, Shintaro. (2021). Resin composition, melt-forming material, multilayer structure, and hot-water sterilizable packaging material (U.S. Patent No. 11161971). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11161971
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile