The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Dec. 18, 2018
Hangzhou Silan Integrated Circuits Co., Ltd., Hangzhou, CN;
Hangzhou Silan Microelectronics Co., Ltd., Hangzhou, CN;
Yongxiang Wen, Hangzhou, CN;
Chen Liu, Hangzhou, CN;
Feng Ji, Zhejiang, CN;
XiaoLi Zhang, Hangzhou, CN;
HANGZHOU SILAN INTEGRATED CIRCUITS CO., LTD., Hangzhou, CN;
HANGZHOU SILAN MICROELECTRONICS CO., LTD., Hangzhou, CN;
Abstract
Disclosed a MEMS assembly and a manufacturing method thereof. The manufacturing method comprises: forming a groove on a sensor chip; forming a bonding pad on a circuit chip; bonding the sensor chip and the circuit chip together to form a bonding assembly; performing a first dicing process at a first position of the sensor chip to penetrate through the sensor chip to the groove; performing a second dicing process at a second position of the sensor chip to penetrate through the sensor chip and the circuit chip, for obtaining an individual MEMS assembly by singulating the bonding assembly, wherein location of the groove corresponds to a position of the bonding pad, and an opening is formed in the sensor chip to expose the bonding pad when the second dicing process is performed. The method uses two dicing process respectively achieving different depths to expose the bonding pad of the sensor chip and singulate the MEMS assembly, respectively, to improve yield and reliability.