The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Oct. 11, 2016
Applicant:
Nestec S.a., Vevey, CH;
Inventors:
Sumeet Dhawan, Twinsburg, OH (US);
Erich Heinze, Streetsboro, OH (US);
Ulrich Johannes Erle, Cleveland, OH (US);
Assignee:
Societe des Produits Nestie S.A., Vevey, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 6/80 (2006.01); H05B 6/68 (2006.01); B65D 77/04 (2006.01); B65D 81/34 (2006.01);
U.S. Cl.
CPC ...
B65D 81/3453 (2013.01); B65D 2581/3443 (2013.01); B65D 2581/3447 (2013.01); B65D 2581/3498 (2013.01);
Abstract
A package is configured for heating a food in a solid state microwave oven, and a method heats a food in a solid state microwave oven. Particularly, the package comprises includes a tray and a susceptor, and a thermal insulation is positioned between the susceptor and a food to be placed in the tray.
Dhawan, Sumeet. (2021). Package for food product (U.S. Patent No. 11161677). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11161677
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile