The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Sep. 24, 2019
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Manabu Otsuka, Kawasaki, JP;
Tetsushi Ishikawa, Tokyo, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); B41J 2/16 (2006.01); B32B 7/06 (2019.01); B32B 27/06 (2006.01); B32B 7/05 (2019.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B32B 7/05 (2019.01); B32B 7/06 (2013.01); B32B 27/06 (2013.01); B32B 37/025 (2013.01); B32B 38/10 (2013.01); B32B 38/164 (2013.01); B32B 43/006 (2013.01); Y10T 156/1111 (2015.01);
Abstract
A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.