The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Aug. 11, 2017
Mazda Motor Corporation, Hiroshima, JP;
Masanori Nakai, Hiroshima, JP;
Akira Hashimoto, Higashihiroshima, JP;
MAZDA MOTOR CORPORATION, Hiroshima, JP;
Abstract
A metallic member bonding device includes a pressurizing unit, a current supply unit, and a deformation suppressing unit. The pressurizing unit pressurizes a first metallic member toward a hole portion of a second metallic member to press the first metallic member therein. The current supply unit supplies a welding current between the first metallic member and the second metallic member. The deformation suppressing unit suppresses deformation of one of the first metallic member and the second metallic member, the one member having a constituent metallic material with at least one of a proof stress and a melting temperature lower than that of the other member, the deformation being in a direction of a cross section crossing a direction of the press-in. Then, the deformation suppressing unit is provided in a region covering at least a plastic flow range in the press-in direction.