The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Aug. 01, 2019
Applicant:

At&s (Chongqing) Company Limited, Chongqing, CN;

Inventors:

Yu-Hui Wu, Taoyuan, TW;

Christopher Katzko, Chongqing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H05K 1/0204 (2013.01); H05K 1/036 (2013.01); H05K 1/0366 (2013.01); H05K 3/42 (2013.01); H05K 3/4682 (2013.01); H05K 3/0032 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/068 (2013.01); H05K 2203/107 (2013.01);
Abstract

A component carrier includes a base structure with component carrier material and forming a cavity, a component embedded in the cavity, a first electrically insulating layer structure connected to a front side of the base structure and to the component and at least partially filling a gap between the component and the base structure, and a second electrically insulating layer structure connected to the first electrically insulating layer structure at a connection surface of the first electrically insulating layer structure. The connection surface opposes an opposing surface of the second electrically insulating layer structure faces away from the first electrically insulating layer structure.


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