The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Apr. 26, 2019
Applicants:

Tsinghua University, Beijing, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Ze-Cheng Hou, Beijing, CN;

Yuan-Feng Liu, Beijing, CN;

Lin Zhu, Beijing, CN;

Wen-Zhen Li, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 28/00 (2006.01); C25D 5/48 (2006.01); H01M 4/04 (2006.01); H01M 4/36 (2006.01); H01M 4/88 (2006.01); H01M 4/133 (2010.01); C25F 3/02 (2006.01); C25D 5/12 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/0452 (2013.01); C23C 28/322 (2013.01); C23C 28/34 (2013.01); C25D 5/12 (2013.01); C25D 5/48 (2013.01); C25F 3/02 (2013.01); H01M 4/0461 (2013.01); H01M 4/133 (2013.01); H01M 4/366 (2013.01); H01M 4/8882 (2013.01); H01M 2004/027 (2013.01); H01M 2004/028 (2013.01);
Abstract

A method for making nanoporous nickel composite material comprises: providing a cathode plate and a copper-containing anode plate, electroplating a copper material layer a surface of the cathode plate; laying a carbon nanotube layer on the copper material layer, and forming an overlapped structure of the copper material layer and the carbon nanotube laye; the cathode plate and the overlapped structure are used as a cathode, and a nickel-containing anode plate is used as an anode, plating a nickel material layer on the overlapped structure to form sandwich structure; repeating steps Sto Sto obtain a carbon nanotube-reinforced copper-nickel alloy; rolling and annealing the carbon nanotube-reinforced copper-nickel alloy; and etching the carbon nanotube-reinforced copper-nickel alloy to form the nanoporous nickel composite material.


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