The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Sep. 25, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ashim Dutta, Menands, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Lijuan Zou, Slingerlands, NY (US);

John Arnold, North Chatham, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/12 (2006.01); H01L 43/10 (2006.01); H01L 43/02 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); H01L 27/222 (2013.01); H01L 43/02 (2013.01); H01L 43/10 (2013.01);
Abstract

Controlled IBE techniques for MRAM stack patterning are provided. In one aspect, a method of forming an MRAM device includes: patterning an MRAM stack disposed on a dielectric into individual memory cells using IBE landing on the dielectric while dynamically adjusting an etch time to compensate for variations in a thickness of the MRAM stack, wherein each of the memory cells includes a bottom electrode, an MTJ, and a top electrode; removing foot flares from the bottom electrode of the memory cells which are created during the patterning of the MRAM stack; removing residue from sidewalls of the memory cells which includes metal redeposited during the patterning of the MRAM stack and during the removing of the foot flares; and covering the memory cells in a dielectric encapsulant. An MRAM device is also provided.


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