The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Nov. 27, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jae-Woong Nah, Closter, NJ (US);

Li-Wen Hung, Mahopac, NY (US);

Eric P. Lewandowski, White Plains, NY (US);

Adinath S. Narasgond, Yonkers, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/06 (2006.01); G06N 10/00 (2019.01); H01L 27/18 (2006.01); H01L 39/04 (2006.01); H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
H01L 39/06 (2013.01); G06N 10/00 (2019.01); H01L 27/18 (2013.01); H01L 39/04 (2013.01); H01L 39/24 (2013.01);
Abstract

A quantum device includes a qubit chip having a plurality of qubits and an interposer attached to and electrically connected to the qubit chip. The device also includes a substrate handler attached to one side of the qubit chip or to one side of the interposer, or both so as to be thermally in contact with the qubit chip or the interposer, or both. The substrate handler includes a plurality of vias, at least a portion of plurality of vias being filled with a non-superconducting material, the non-superconducting material being selected to dissipate heat generated in the qubit chip, the interposer or both.


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