Led package

Abstract

An LED package is disclosed. The LED package includes: a base including a chip mounting surface; an LED chip including a central axis line perpendicular to the chip mounting surface; a total internal reflection (TIR) lens having a refractive index higher than that of a medium covering the upper and side surfaces of the LED chip and including entrance planes bordering the medium and exit planes from which light entering through the entrance planes is emitted; and a reflector coupled to the TIR lens. The entrance planes include main entrance planes having one or more radii of curvature and protruding toward the LED chip and a pair of lateral entrance planes connected to the main entrance planes at the edges of the main entrance planes and extending downward from the main entrance planes. The exit planes include a main exit plane located above the main entrance planes and a pair of lateral exit planes connected to the main exit plane at the edges of the main exit plane, extending downward from the main exit plane, and connected to the pair of lateral entrance planes. Two points on the main entrance planes at the same height from the LED chip are not equidistant from the central axis line such that the amount of light passing through the main entrance planes is localized to one side of the central axis line.