The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Feb. 20, 2019
Applicant:

Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Hubei, CN;

Inventor:

Shasha Li, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 27/12 (2006.01); H01L 23/544 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4958 (2013.01); H01L 23/544 (2013.01); H01L 27/124 (2013.01); H01L 27/1288 (2013.01); H01L 29/66757 (2013.01); H01L 29/78675 (2013.01); H01L 21/02565 (2013.01);
Abstract

Provided are a method for manufacturing a thin-film transistor (TFT) substrate and a TFT substrate. The method for manufacturing a TFT substrate is capable of effectively protecting the surface of the inorganic insulating layer in the mark area and the mark peripheral area during performing dry etching on the metal layer by providing a protective layer between the inorganic insulating layer and the metal layer to reduce the surface damage of the inorganic insulating layer during dry etching, thereby effectively improving the recognition rate of the alignment mark by the CCD camera in the subsequent alignment process, improving the alignment detection accuracy, and avoiding subsequent alignment anomalies. In addition, it is not necessary to adjust the dry etching parameters of the metal layer, which indirectly reduces the process constraints of the dry etching process, avoids modification and calibration of the alignment CCD camera, and lowers production costs.


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