The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Jun. 10, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Yong-Jae Kim, Seongnam-si, KR;
Kil-Ho Lee, Busan, KR;
Dae-Eun Jeong, Yongin-si, KR;
Gwan-Hyeob Koh, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/02 (2006.01); H01L 43/12 (2006.01); H01L 27/22 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/228 (2013.01); H01L 21/76885 (2013.01); H01L 43/02 (2013.01); H01L 43/12 (2013.01);
Abstract
A semiconductor device may include a conductive structure on a substrate, a contact plug on the conductive structure, and a magnetic tunnel junction structure on the contact plug. A lower surface of the contact plug may have an area greater than that of an upper surface thereof, and the contact plug may include a capping pattern at least partially covering an upper surface of the conductive structure, a conductive pattern on the capping pattern, and an amorphous metal pattern on the conductive pattern.